File:Bga und via IMGP4531 wp showing a via with NonFunctionalPad Removed.jpg

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Deutsch: Schnitt durch ein SDRAM-Modul/-Riegel. Es handelt sich um eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via). Aufnahme mit Pentax *ists, daran angebastelt ein Minolta MC 1.8/35mm in Retrostellung an einem Novoflex-Balgengerät. Blende 11, 1/160s, Beleuchtung mit Mecablitz 45CT1 und externem Sensor Mecamat 45-20.
English: Cut through an SDRAM-Module. It is a multi-layer Printed Circuit Board (PCB) with BGA-packaging. On the right side a via.
Français : Coupe d'un circuit imprimé (Mémoire SDRAM) à 4 couches avec un composant de type BGA. A droite est situé un trou traversant métallisé.
Polski: Przekrój przez moduł pamięci SDRAM. Jest to wielowarstwowy obwód drukowany z przylutowanym układem scalonym w obudowie BGA. Po prawej stronie widoczna jest przelotka.
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Image: Rainer Knäpper, Free Art License

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Photo: Rainer Knäpper, Free Art License (http://artlibre.org/licence/lal/en/), https://commons.wikimedia.org/wiki/File:Bga_und_via_IMGP4531_wp_showing_a_via_with_NonFunctionalPad_Removed.jpg

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current03:43, 23 July 2018Thumbnail for version as of 03:43, 23 July 20181,702 × 1,232 (719 KB)MichaelFrey (talk | contribs)== {{int:filedesc}} == {{Information |Description= {{de|Schnitt durch ein SDRAM-Modul/-Riegel. Es handelt sich um eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via). Aufnahme mit Pentax *ists, daran angebastelt ein Minolta MC 1.8/35mm in Retrostellung an einem Novoflex-Balgengerät. Blende 11, 1/160s, Beleuchtung mit Mecablitz 45CT1 und externem Sensor Mecamat 45-20.}} {{en|Cut through an [[:en:Memo...

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